AM29LV641DH101RFEN Просмотр технического описания (PDF) - Advanced Micro Devices
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AM29LV641DH101RFEN
Advanced Micro Devices
AM29LV641DH101RFEN Datasheet PDF : 57 Pages
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CONNECTION DIAGRAMS
64-Ball Fortified BGA (FBGA)
Top View, Balls Facing Down
(Am29LV640DU only)
A8
RFU
B8
RFU
C8
RFU
A7
B7
C7
A13
A12
A14
A6
B6
C6
A9
A8
A10
A5
B5
C5
WE# RESET# A21
A4
B4
C4
RY/BY# ACC A18
A3
B3
C3
A7
A17
A6
A2
B2
C2
A3
A4
A2
A1
RFU
B1
RFU
C1
RFU
D8
VIO
D7
A15
D6
A11
D5
A19
D4
A20
D3
A5
D2
A1
D1
RFU
E8
VSS
E7
A16
E6
DQ7
E5
DQ5
E4
DQ2
E3
DQ0
E2
A0
E1
RFU
F8
RFU
G8
RFU
H8
RFU
F7
G7
NC DQ15
F6
DQ14
G6
DQ13
H7
VSS
H6
DQ6
F5
G5
DQ12 VCC
F4
DQ10
G4
DQ11
H5
DQ4
H4
DQ3
F3
DQ8
G3
DQ9
H3
DQ1
F2
CE#
F1
VIO
G2
OE#
G1
RFU
H2
VSS
H1
RFU
Special Handling Instructions for
FBGA/fBGA Packages
Special handling is required for Flash Memory products
in BGA packages.
Flash memory devices in BGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
8
Am29LV640D/Am29LV641D
September 20, 2002
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