S25FL129P Просмотр технического описания (PDF) - Spansion Inc.
Номер в каталоге
Компоненты Описание
производитель
S25FL129P Datasheet PDF : 69 Pages
| |||
Data Sheet
Figure 2.2 8-contact WSON Package (6 x 8 mm)
CS#
SO/IO1
W#/ACC/IO2
1
8
2
7
WSON
3
6
VCC
HOLD#/IO3
SCK
GND 4
5 SI/IO0
Note
There is an exposed central pad on the underside of the WSON package. This should not be connected to any voltage or signal line on the
PCB. Connecting the central pad to GND (VSS) is possible, provided PCB routing ensures 0mV difference between voltage at the WSON
GND (VSS) lead and the central exposed pad.
Figure 2.3 6 x 8 mm 24-ball BGA Package, 5 x 5 Pin Configuration
1
2
3
4
5
A
NC
NC
NC
NC
B
NC
SCK GND VCC
NC
C
NC
CS#
NC W#/ACC/IO2 NC
D
NC SO/IO1 SI/IO0 HOLD#/IO3 NC
E
NC
NC
NC
NC
NC
Figure 2.4 6 x 8 mm 24-ball BGA Package, 6 x 4 Pin Configuration
A1
A2
A3
A4
NC
NC
NC
NC
B1
B2
B3
B4
NC
SCK
GND
VCC
C1
C2
C3
C4
NC
CS#
NC W#/ACC/IO2
D1
D2
D3
D4
NC SO/IO1 SI/IO0 HOLD#/IO3
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
10
S25FL129P
S25FL129P_00_08 September 21, 2012
Share Link: 