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IR2151(Old_V) Просмотр технического описания (PDF) - International Rectifier

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Компоненты Описание
производитель
IR2151
(Rev.:Old_V)
IR
International Rectifier IR
IR2151 Datasheet PDF : 6 Pages
1 2 3 4 5 6
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Device Information
Process & Design Rule
Transistor Count
Die Size
Die Outline
Index
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IR2151
HVDCMOS 4.0 µm
231
68 X 101 X 26 (mil)
Thickness of Gate Oxide
Connections
First
Layer
Second
Layer
Contact Hole Dimension
Insulation Layer
Passivation
Method of Saw
Method of Die Bond
Wire Bond
Leadframe
Package
Remarks:
Material
Width
Spacing
Thickness
Material
Width
Spacing
Thickness
Material
Thickness
Material
Thickness
Method
Material
Material
Die Area
Lead Plating
Types
Materials
800Å
Poly Silicon
5 µm
6 µm
5000Å
Al - Si - Cu (Si: 1.0%, Cu ±0.5%)
6 µm
9 µm
20,000Å
5 µm X 5 µm
PSG (SiO2)
1.7 µm
PSG (SiO2)
1.7 µm
Full Cut
Ablebond 84 - 1
Thermo Sonic
Au (1.0 mil / 1.3 mil)
Cu
Ag
Pb : Sn (37 : 63)
8 Lead PDIP / SO-8
EME6300 / MP150 / MP190
To Order
CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL B-191

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