CLF1G0035-100 Просмотр технического описания (PDF) - NXP Semiconductors.
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CLF1G0035-100 Datasheet PDF : 20 Pages
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NXP Semiconductors
CLF1G0035-100; CLF1G0035S-100
Broadband RF power GaN HEMT
15. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.3
7.4
8
8.1
8.2
8.3
9
10
10.1
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Demo circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application test results . . . . . . . . . . . . . . . . . . . 7
Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 8
1-Tone CW RF performance. . . . . . . . . . . . . . . 8
1-Tone pulsed RF performance . . . . . . . . . . . . 9
2-Tone CW performance . . . . . . . . . . . . . . . . 10
Bias module . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
Ruggedness in class-AB operation . . . . . . . . 11
Load pull impedance information . . . . . . . . . . 11
Packaged S-parameter data. . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Handling information. . . . . . . . . . . . . . . . . . . . 17
ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 January 2013
Document identifier: CLF1G0035-100_1G0035S-100
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