VN750-E Просмотр технического описания (PDF) - STMicroelectronics
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VN750-E Datasheet PDF : 31 Pages
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VN750-E / VN750S-E / VN750PT-E / VN750B5-E
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
VCC
5
OUTPUT
OUTPUT
VCC
8
4 N.C.
STATUS
INPUT
1 GND
SO-8
5
OUTPUT
4
STATUS
3
VCC
2
INPUT
1
GND
PPAK / P2PAK
PENTAWATT
Connection / Pin Status
Floating
X
To Ground
N.C.
X
X
Output
Input
X
X
Through 10KΩ resistor
Figure 4. Current and Voltage Conventions
IIN
ISTAT
VIN
VSTAT
INPUT
VCC
STATUS
OUTPUT
GND
IGND
IS
VF
IOUT
VCC
VOUT
Table 4. Thermal Data
Symbol
Parameter
Rthj-case Thermal Resistance Junction-case
Rthj-lead Thermal Resistance Junction-lead
Max
Max
Rthj-amb Thermal Resistance Junction-ambient Max
S0-8
-
30
93 (1)
82 (2)
Value
PENTAWATT P2PAK
2.1
2.1
-
62.1
62.1
-
52.1 (3)
37 (4)
PPAK
2.1
-
77.1 (3)
44 (4)
Unit
°C/W
°C/W
°C/W
°C/W
(1) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow.
(2) When mounted on a standard single-sided FR-4 board with 2cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal mount-
ing and no artificial air flow.
(3) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial air
flow.
(4) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial air flow.
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