PQ1M335M2SPQ Просмотр технического описания (PDF) - Sharp Electronics
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PQ1M335M2SPQ Datasheet PDF : 4 Pages
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PQ1Mxx5M2SPQ Series
Fig.3 Power Dissipation vs. Ambient
Temperature
1000
Mounting PCB
900
800
700
600
500
400
300
200
100
0
-40 -25 0 25 50 7585 100 125 150
Ambient temperature Ta (°C)
Material
PCB Size
Copper foil area
Thickness of copper
Note) Oblique line portion:Overheat protection may operate in this area.
PCB
Copper foil
Fig.4 Overcurrent Protection Characteristics
(Typical Value)
100
Fig.5 Output Voltage vs. Input Voltage
(Typical Value) (PQ1M335M2SPQ)
4
75
50
25
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Output current IO (A)
3
RL=6.6Ω
RL=13.2Ω
2
RL=∞Ω
1
0
01
23
Ta=25°C
CIN=CO=1μF
(Ceramic capacitor)
CN=0.01μF
(Ceramic capacitor)
4 56 7
Input voltage VIN (V)
Fig.6 Circuit Operating Current vs. Input Voltage
(Typical Value) (PQ1M335M2SPQ)
50
Ta=25°C
CIN=CO=1μF
(Ceramic capacitor)
40
CN=0.01μF
(Ceramic capacitor)
RL=6.6Ω
30
20
RL=13.2Ω
10
RL=∞Ω
0
01234567
Input voltage VIN (V)
Fig.7 Quiescent Current vs. Junction
Temperature (Typical Value)
1000
900
VIN=VO(TYP.)+1.0V
VC=1.8V
IO=0mA
800
700
600
500
400
300
200
-50 -25 0 25 50 75 100 125
Junction temperature Tj (°C)
Sheet No.: OP06037
3
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