NXP Semiconductors
120
Pder
(%)
80
017aaa123
PMXB360ENEA
80 V, N-channel Trench MOSFET
120
Ider
(%)
80
017aaa124
40
40
0
- 75
- 25
25
75
125
175
Tj (°C)
Fig. 2. Normalized total power dissipation as a
function of junction temperature
0
- 75
- 25
25
75
125
175
Tj (°C)
Fig. 3. Normalized continuous drain current as a
function of junction temperature
10
ID
(A)
1
Limit RDSon = VDS/ID
aaa-009009
tp = 10 µs
tp = 100 µs
DC; Tsp = 25 °C
10-1
DC; Tamb = 25 °C;
drain mounting pad 6 cm2
10-2
10-1
1
IDM = single pulse
tp = 1 ms
tp = 10 ms
tp = 100 ms
10
102
VDS (V)
Fig. 4. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-
source voltage
9. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
Conditions
in free air
Min Typ Max Unit
[1]
-
271 312 K/W
[2]
-
102 117 K/W
PMXB360ENEA
Product data sheet
All information provided in this document is subject to legal disclaimers.
16 September 2013
© NXP N.V. 2013. All rights reserved
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