MCP1630 Просмотр технического описания (PDF) - Microchip Technology
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MCP1630 Datasheet PDF : 26 Pages
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MCP1630/MCP1630V
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,
VIN for typical values = 5.0V, TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Current Sense Input
Maximum Current Sense Signal VCS_MAX
0.85
0.9
0.95
MCP1630
V Set by maximum error amplifier
clamp voltage, divided by 3.
Delay From CS to VEXT
MCP1630
TCS_VEXT
—
12
25
ns
Maximum Current Sense Signal VCS_MAX
2.55
2.7
2.85
MCP1630V
Delay From CS to VEXT
MCP1630V
TCS_VEXT
—
17.5
35
V VIN > 4.25V
Maximum CS input range limited by
comparator input common mode
range. VCS_MAX = VIN-1.4V
ns
Minimum Duty Cycle
DCMIN
—
—
0
Current Sense Input Bias Current
Internal Driver
ICS_B
—
-0.1
—
% VFB = VREF + 0.1V,
VCS = GND
µA VIN = 5V
RDSON P-channel
RDSON N-channel
VEXT Rise Time
VEXT Fall Time
Protection Features
RDSon_P
—
10
30
RDSon_N
—
7
30
TRISE
—
5.9
18
TFALL
—
6.2
18
ns CL = 100 pF
Typical for VIN = 3V
ns CL = 100 pF
Typical for VIN = 3V
Under Voltage Lockout
UVLO
2.7
—
3.0
V VIN falling, VEXT low state when in
UVLO
Under Voltage Lockout Hysteresis UVLO HYS
50
75
150
mV
Thermal Shutdown
TSHD
—
150
—
°C
Thermal Shutdown Hysteresis
TSHD_HYS
—
18
—
°C
Note 1: Capable of higher frequency operation depending on minimum and maximum duty cycles needed.
2: External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal
levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.
3: The reference input of the internal amplifier is capable of rail-to-rail operation.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
TA
Storage Temperature Range
TA
Maximum Junction Temperature
TJ
Thermal Package Resistances
Thermal Resistance, 8L-DFN
JA
(2 mm x 3 mm)
Thermal Resistance, 8L-MSOP
JA
-40
—
+125 °C Steady state
-65
—
+150 °C
—
—
+150 °C Transient
—
50.8
— °C/W Typical 4-layer board with two
interconnecting vias
—
208
—
°C/W Typical 4-layer board
2004-2013 Microchip Technology Inc.
DS21896C-page 7
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