LSM330DL Просмотр технического описания (PDF) - STMicroelectronics

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LSM330DL

Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

STMicroelectronics 

LSM330DL

Linear sensor module

3D accelerometer sensor and 3D gyroscope sensor

Preliminary data

Features

■ Analog supply voltage 2.4 V to 3.6 V

■ Digital supply voltage I/Os, 1.8V

■ Low-power mode

■ Power-down mode

■ 3 independent acceleration channels and 3

angular rate channels

■ ±2g/±4g/±8g/±16g dynamic, selectable full-

scale acceleration range

■ ±250/±500/±2000 dps dynamic, selectable full-

scale angular rate

■ SPI/I2C serial interface (16-bit data output)

■ Programmable interrupt generator for free-fall

and motion detection

■ ECOPACK®, RoHS, and “Green” compliant

Applications

■ GPS navigation systems

■ Impact recognition and logging

■ Gaming and virtual reality input devices

■ Motion-activated functions

■ Intelligent power saving for handheld devices

■ Vibration monitoring and compensation

■ Free-fall detection

■ 6D-orientation detection

Description

The LSM330DL is a system-in-package featuring

a 3D digital accelerometer and a 3D digital

gyroscope.

Table 1. Device summary

Part number

Temperature range [°C]

LSM330DL

LSM330DLTR

-40 to +85

-40 to +85

LLGA 28L 7.5 x 4.4 x 1.1 mm

ST’s family of modules leverages a robust and

mature manufacturing process already used for

the production of micromachined accelerometers.

The various sensing elements are manufactured

using specialized micromachining processes,

while the IC interfaces are based on CMOS

technology that allows designing a dedicated

circuit which is trimmed to better match the

sensing element characteristics.

The LSM330DL has a dynamic, user-selectable

full-scale acceleration range of ±2g/±4g/±8g/±16g

and an angular rate of ±250/±500/±2000 deg/sec.

The accelerometer and gyroscope sensors can

be either activated or put in low-power / power-

down mode separately for power-saving

optimized applications. The LSM330DL is

available in a plastic land grid array (LGA)

package.

Several years ago ST successfully pioneered the

use of this package for accelerometers. Today, ST

has the broadest manufacturing capability in the

world and unrivalled expertise for the production

of sensors in a plastic LGA package.

Package

LGA-28

LGA-28

Packing

Tray

Tape & reel

July 2011

Doc ID 022018 Rev 1

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

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