HMC5883L Просмотр технического описания (PDF) - Honeywell International
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HMC5883L Datasheet PDF : 18 Pages
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HMC5883L
PCB Pad Definition and Traces
The HMC5883L is a fine pitch LCC package. Refer to previous figure for recommended PCB footprint for proper package
centering. Size the traces between the HMC5883L and the external capacitors (C1 and C2) to handle the 1 ampere peak
current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Reflow Assembly
This device is classified as MSL 3 with 260 C peak reflow temperature. A baking process (125 C, 24 hrs) is required if
device is not kept continuously in a dry (< 10% RH) environment before assembly. No special reflow profile is required for
HMC5883L, which is compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends
adherence to solder paste manufacturer’s guidelines.
INTERNAL SCHEMATIC DIAGRAM
HMC5883L
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