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CX805-30 Просмотр технического описания (PDF) - Skyworks Solutions

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CX805-30 Datasheet PDF : 5 Pages
1 2 3 4 5
CX805-30 BASEBAND PROCESSOR PRODUCT SUMMARY
12 x 12 FPBGA - 160 Balls/ 0.80 mm Ball Pitch
1.5 MAX
0.3 ± 0.05
Mold
0.45 ± 0.05 TYP
Seating Plane
12.00 ± 0.10
Pin 1 Indicator
0.4
0.8
A1 Ball Pad Corner
13 11 9
75
3
1
14 12 10 8 6
4
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
0.4
0.8
NOTES:
1. All dimensions are in millimeters.
2. For die orientation, see appropriate bonding diagram.
3. FPBGA lands are solder mask defined.
4. Minimum solder ball pitch is 0.80 mm.
5. Dimensioning and tolerancing in accordance with ASME Y14.5M-1994
Figure 2. 160-pin FPBGA Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
103171D • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • June 21, 2005
3

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