BTS6163D Просмотр технического описания (PDF) - Infineon Technologies

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Компоненты Описание

производитель

BTS6163D

Smart Highside Power Switch

Infineon Technologies 

PROFET Data sheet BTS 6163 D

Thermal Characteristics

Parameter and Conditions

Symbol

Thermal resistance

chip - case: RthJC

junction - ambient (free air): RthJA

SMD version, device on PCB 6):

Values

Unit

min typ max

--

-- 1.1 K/W

-- 80

--

-- 45 55

Electrical Characteristics

Parameter and Conditions

at Tj= 25, Vbb = 24 V unless otherwise specified

Symbol

Values

Unit

min typ max

Load Switching Capabilities and Characteristics

On-state resistance (pin 3 to pin 1,5)

VIN= 0, Vbb= 5.5V, IL = 7.5 A

Tj=25 °C:

Tj=150 °C:

VIN= 0, Vbb= 12..24V, IL = 7.5 A

Tj=25 °C:

Tj=150 °C:

Output voltage drop limitation at small load

currents (Tab to pin 1,5) 5)

Tj=-40...150 °C:

Nominal load current (Tab to pin 1,5)

ISO Proposal: VON ≤ 0.5 V, TC = 85°C, Tj ≤ 150°C

SMD 6), VON ≤ 0.5 V, TA = 85°C, Tj ≤ 150°C

Turn-on time

to 90% VOUT:

Turn-off time

RL = 3.9 Ω, Tj=-40...150 °C

to 10% VOUT:

Slew rate on

25 to 50% VOUT, RL = 3.9 Ω, Tj=-40...150 °C

Slew rate off

50 to 25% VOUT, RL = 3.9 Ω, Tj=-40...150 °C

RON

VON(NL)

IL(ISO)

IL(nom)

ton

toff

dV /dton

-dV/dtoff

-- 19 25 mΩ

-- 38 50

-- 16 20

-- 32 40

-- 40 65 mV

17 21.5

-- A

5.5 6.5

--

-- 150 300 µs

-- 200 550

-- 0.65 1.0 V/µs

-- 0.65 1.2 V/µs

5) See figure 7a on page 15.

6) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb

connection. PCB is vertical without blown air.

Infineon Technologies AG

Page 3 of 16

2003-Oct-01

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