ACTS08K/SAMPLE Просмотр технического описания (PDF) - Intersil
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ACTS08K/SAMPLE Datasheet PDF : 8 Pages
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ACTS08MS
Die Characteristics
DIE DIMENSIONS:
88 mils x 88 mils
2.24mm x 2.24mm
METALLIZATION:
Type: AlSiCu
Metal 1 Thickness: 6.75kÅ (Min), 8.25kÅ (Max)
Metal 2 Thickness: 9kÅ (Min), 11kÅ (Max)
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
DIE ATTACH:
Material: Silver Glass or JM 7000 Polymer after 7/1/95
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
> 4.3 mils x 4.3 mils
> 110µm x 110µm
Metallization Mask Layout
ACTS08MS
B1
A1
VCC
B4
(2)
(1)
(14)
(13)
Y1 (3)
A2 (4)
NC
B2 (5)
(12) A4
(11) Y4
NC
(10) B3
(6)
(7)
(8)
(9)
Y2
GND
Y3
A3
6
Spec Number 518851
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