WED3C755E8M300BI Просмотр технического описания (PDF) - White Electronic Designs Corporation

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WED3C755E8M300BI

RISC MICROPROCESSOR MULTI-CHIP PACKAGE

White Electronic Designs Corporation 

White Electronic Designs WED3C755E8M-XBX

FIG. 3 - BLOCK DIAGRAM, L2 INTERCONNECT

L2pin_DATA

L2pin_DATA

L2pin_DATA

L2pin_DATA

L2DP0-3

L2 CLK_OUT A

L2WE#

L2CE#

mP

755

E

A0-16

L2CLK_OUT B

L2pin_DATA

L2pin_DATA

L2pin_DATA

L2pin_ DATA

L2DP4-7

SSRAM 1

DQa

DQb

DQc

DQd

DP0-3

K

SGW#

SE1#

U1

FT#

SBd#

SBc#

SBb#

SBa#

SW#

ADSP#

ADV#

SE2

ADSC#

SE3#

SA0-16

ZZ

LBO#

G#

SSRAM 2

SA0-16

SGW#

SE1#

K

U2

FT#

SBd#

SBc#

SBb#

SBa#

SW#

ADSP#

ADV#

DQa

SE2

DQb

ADSC#

DQc

SE3#

DQd

DP0-3

LBO#

G#

ZZ

L2ZZ

L20Vdd

L20Vdd

FIG. 4. - BLOCK DIAGRAM, L2 INTERCONNECT

TDI

TDO

755 E

STDI

L2 Cache

SSRAM

U2

L2 Cache

SSRAM

U1

STDO

TMS TCK TRST

STMS STCK

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

May, 2003

Rev 2

3

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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