CONTENTS
µPD75P3216
1. PIN CONFIGURATION (Top View) .................................................................................................... 4
2. BLOCK DIAGRAM .............................................................................................................................. 5
3. PIN FUNCTIONS ................................................................................................................................. 6
3.1 Port Pins ...................................................................................................................................................... 6
3.2 Non-port Pins .............................................................................................................................................. 7
3.3 Equivalent Circuits for Pins ...................................................................................................................... 8
3.4 Recommended Connection of Unused Pins ........................................................................................ 10
4. Mk I AND Mk II MODE SELECTION FUNCTION ............................................................................ 11
4.1 Difference between Mk I Mode and Mk II Mode ................................................................................... 11
4.2 Setting of Stack Bank Selection (SBS) Register ................................................................................. 12
5. Differences between µPD75P3216 and µPD753204, 753206, and 753208 ................................13
6. MEMORY CONFIGURATION ........................................................................................................... 14
7. INSTRUCTION SET ........................................................................................................................... 16
8. ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ................................................. 25
8.1 Operation Modes for Program Memory Write/Verify ........................................................................... 25
8.2 Program Memory Write Procedure ........................................................................................................ 26
8.3 Program Memory Read Procedure ........................................................................................................ 27
8.4 One-time PROM Screening ..................................................................................................................... 28
9. ELECTRICAL SPECIFICATIONS ..................................................................................................... 29
10. CHARACTERISTIC CURVE (REFERENCE VALUE) ...................................................................... 42
11. PACKAGE DRAWINGS .................................................................................................................... 44
12. RECOMMENDED SOLDERING CONDITIONS ............................................................................... 45
APPENDIX A. µPD753108, 753208, AND 75P3216 FUNCTIONAL LIST ........................................... 46
APPENDIX B. DEVELOPMENT TOOLS ............................................................................................... 48
APPENDIX C. RELATED DOCUMENTS ............................................................................................... 52
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