TMP47C820DF Просмотр технического описания (PDF) - Toshiba
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TMP47C820DF Datasheet PDF : 48 Pages
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Quality and Reliability Assurance / Handling Precautions
2.1.1 Precaution for Dry Pack
Figure 2.2 shows the tray type of the dry
pack form. Precaution for handling dry pack
products are as follows.
x Do not toss or drop to avoid damaging the
devices and/or the moisture proof bag.
(a) Method
Heat-proof tray (occasionally non-heat-proof)
y Desiccant in the form of granulated silica
gel includes blue indicator beads which
become transparent when moisture is
present, such as if the bag is torn or opened.
In this case, the devices must be high
temperature baked to remove the moisture
prior to solder mounting.
Indicator
IC
Silica gel
Heat proof tray
z Store the pack at 30°C / 90%RH. After
opening the pack mount it the device within
12 months of the date on the seal. If the
30% humidity indicator is entirely pink
when the device unpacked, or when the 12-
month duration has expired treat the
device before use at high temperature (bake
it at more than 125°C for 20h) to remove
moisture.
{ How quickly a product should be used after
the pack is opened depends of the product.
See Tables 2-2 and 2-3 for details. If the
time limit for use has expired when devices
are unpacked, they should be baked.
Plastic band
Moisture proof bag
(Aluminum laminate)
Label
Turn under
Heat seal
| Devices in heat-proof trays should be baked
at 125°C for at least 20h.
Heat-proof trays bear the mold marking
“HEAT PROOF” .
Be careful not to bend the leads when
baking devices.
(b) Shipping carton
} Binding trays using a plastic tapes
If trays are rebound with plastic tapes after
having been untied, two tapes should be
used as shown in Figure 2.2 (a). If a tape is
tied lengthwise along the trays the tray
edges may break.
Corrugated
cardboard box
Corrugated
cardboard box
Sealing tape
Figure 2.2 SMDs Dry pack Form
030901
QUA-8
2002-02-20
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