TMP91C829F Просмотр технического описания (PDF) - Toshiba

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TMP91C829F

Quality And Reliability Assurance / Handling Precautions

Toshiba 

Quality and Reliability Assurance / Handling Precautions

2 Handling Precautions for Microcontrollers

2.1 Mounting Precautions

Plastics have basically porous feature. When a chip (especially an SMD which has a thin

plastic surface) is heated in a state of moisturized and is soldered by the reflow soldering

method, moisture is vaporized as the temperature rises to cause a package expanded. Or a

borderd surface between a lead frame and a plastic material is peeled off to cause a crack.

These bring serious troubles on reliability.

In order to prevent hygroscopity or enable high heat treatment after absorbing moisture,

Toshiba uses a dampproof packing and/or a heat proof tray.

(1) Recommended Methods of Soldering for Flat Packages

• Table 2.1 lists the recommended method of soldering flat packages. If you have

any question or request, please refer to “IC PACKAGE MANUAL” or contact

your local offices.

• For overall heating method, recommended mounting methods and

conditions after opening the pack differ depending on products to be

used. See Table 2.2 and 2.3 for the details.

• For locally heating a lead part, soldering iron method is

recommended. For other localized heating methods, refer to “IC

PACKAGE MANUAL” or contact your Toshiba local offices.

030901

QUA-5

2002-02-20

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