TMP91C829F Просмотр технического описания (PDF) - Toshiba
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TMP91C829F Datasheet PDF : 48 Pages
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Quality and Reliability Assurance / Handling Precautions
(3) 870 Series
Table 2.5 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/3)
Products
Name
Air reflow
Infrared reflow
TMP87C800F
TMP87CH00F
TMP87PH00F
TMP87C800DF
TMP87CH00DF
TMP87CH00LF
TMP87PH00DF
TMP87PH00LF
TMP87C807U
TMP87C408M
TMP87C408LM
TMP87C808M
TMP87C808LM
TMP87C408DM
TMP87P808M
TMP87P808LM
TMP87C814F
TMP87CH14F
TMP87CK14F
TMP87CM14F
TMP87PM14F
TMP87CC20F
TMP87CH20F
TMP87PH20F
TMP87CK20AF
TMP87CM20AF
TMP87PM20F
TMP87CH21F
TMP87CH21BF
TMP87CH21DF
TMP87CH21BDF
TMP87CM21F
TMP87CM21DF
TMP87PP21F
TMP87PP21DF
TMP87CM23F
TMP87CP23F
TMP87PP23F
TMP87CM24AF
TMP87CP24AF
TMP87PP24AF
TMP87CH29U
TMP87CK29U
TMP87CM29U
TMP87PM29U
Note 1: As of March, 2001
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
030901
QUA-14
2002-02-20
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