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TMP91C829F

Quality And Reliability Assurance / Handling Precautions

Toshiba

TMP91C829F Datasheet PDF : 48 Pages

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Quality and Reliability Assurance / Handling Precautions

(2) 90 Series

Table 2.4 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (1/2)

Products

Name

TMP90C840AF

TMP90C841AF

TMP91C640F

TMP91C641F

TMP90CM40AF

TMP90C041AF

TMP90C141F

TMP90C441F

TMP90C802AM

TMP90C803AM

TMP90CH02M

TMP90CH03M

TMP90C400F

TMP90C401F

TMP90C800F

TMP90C801F

TMP90C844AF

TMP90CH44F

TMP90C845AF

TMP90CH45F

TMP90CM36F

TMP90CM37F

TMP90CM38F

TMP90CM39F

TMP90C051F

TMP90CS36F

TMP90CS37F

TMP90CS38F

TMP90CS39F

TMP90C848F

TMP91P640F

TMP90PM40F

TMP90P802AM

TMP90PH02M

TMP90P800F

TMP90PH44F

TMP90PM36F

TMP90PM38F

TMP90PS36F

TMP90PS38F

Package no.

P-QFP64-1420-1.00A

P-SSOP40-450-0.80

P-QFP64-1420-1.00A

P-QFP80-1414-0.65A

P-QFP80-1420-0.80B

P-QFP80-1414-0.65A

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

P-SSOP40-450-0.80

P-QFP64-1420-1.00A

P-QFP80-1414-0.65A

P-QFP44-1414-0.65A

Air reflow

A(168h)



A(168h)



A(168h)

Infrared reflow

A(168h)



A(168h)



A(168h)

Note 1: As of September, 2001

Note 2: Ensure that the conditions for top/bottom heating using the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-12

2002-02-20

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