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TLSH156P Просмотр технического описания (PDF) - Toshiba

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TLSH156P Datasheet PDF : 4 Pages
1 2 3 4
TLSH156P
Precaution
Please be careful of the followings
· Soldering temperature: 260°C max
Soldering time: 3s max
(Soldering portion of lead: Up to 2mm from the body of the device)
· If the lead is formed, the lead should be formed up to 5mm from the body of the device without forming stress to
the resin. Soldering should be performed after lead forming.
· This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure
that it will not be affected by this IR light.
2
2002-09-25

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