HT817D0 Просмотр технического описания (PDF) - Holtek Semiconductor

Номер в каталоге

Компоненты Описание

производитель

HT817D0

16.8-Second LOG-PCM Speech

Holtek Semiconductor 

Pad Assignment

K E Y 10

K E Y 11

K E Y 12

1 19

2

3

18 17 16

15 14

13

12

11

KEY4

KEY3

KEY2

KEY1

HT817D0

(0 ,0 )

4

5

6

7

8 9 10

Chip size: 2270 ´ 3630 (mm)2

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pad Coordinates

Pad No.

1

2

3

4

5

6

7

8

9

10

X

-914.50

-914.50

-914.50

-987.90

-254.60

-18.90

411.90

674.70

806.10

937.90

Y

1612.75

1469.35

1278.75

-1638.25

-1611.75

-1611.75

-1611.75

-1611.75

-1642.35

-1611.75

Pad No.

11

12

13

14

15

16

17

18

19

X

912.80

912.80

912.80

912.80

709.50

179.20

22.00

-156.40

-734.20

Unit: mm

Y

1115.95

1254.55

1449.95

1593.55

1564.05

1564.05

1564.05

1564.05

1564.05

3

March 15, 2000

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