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STPS30170DJF(2011) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
STPS30170DJF
(Rev.:2011)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS30170DJF Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
STPS30170DJF
2
Package information
Package information
Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5. PowerFLAT 5x6 dimensions
Dimensions
Ref.
Millimeters
Inches
A
A1
D2
E2
K
e
b
L
D
A2
E
Min. Typ. Max. Min. Typ. Max.
A 0.80
1.00 0.031
0.039
A1 0.02
0.05 0.001
0.002
A2
0.25
0.010
b 0.30
0.50 0.012
0.020
D
5.20
0.205
D2 4.11
4.31 0.162
0.170
e
1.27
0.050
E
6.15
0.242
E2 3.50
3.70 0.138
0.146
L 0.50
0.80 0.020
0.031
K 1.275
1.575 0.050
0.062
Figure 11. Footprint (dimensions in mm)
5.35
4.41
0.98
0.95
0.62
1.27
Doc ID 16749 Rev 3
5/7

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