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STB200NF03-1(2002) Просмотр технического описания (PDF) - STMicroelectronics

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STB200NF03-1 Datasheet PDF : 14 Pages
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STB200NF03/-1 STP200NF03
Thermal Resistance Rthj-a vs PCB Copper Area
Max Power Dissipation vs PCB Copper Area
Allowable Iav vs. Time in Avalanche
The previous curve gives the safe operating area for unclamped inductive loads, single pulse or repetitive,
under the following conditions:
PD(AVE) = 0.5 * (1.3 * BVDSS * IAV)
EAS(AR) = PD(AVE) * tAV
Where:
IAV is the Allowable Current in Avalanche
PD(AVE) is the Average Power Dissipation in Avalanche (Single Pulse)
tAV is the Time in Avalanche
To derate above 25 oC, at fixed IAV, the following equation must be applied:
Where:
IAV = 2 * (Tjmax - TCASE)/ (1.3 * BVDSS * Zth)
Zth = K * Rth is the value coming from Normalized Thermal Response at fixed pulse width equal to TAV .
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