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UPD78P368AGF-3B9 Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге
Компоненты Описание
производитель
UPD78P368AGF-3B9
NEC
NEC => Renesas Technology NEC
UPD78P368AGF-3B9 Datasheet PDF : 52 Pages
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mPD78P368A
CONTENTS
1. PIN FUNCTIONS ........................................................................................................................ 8
1.1 NORMAL OPERATION MODE (MODE0 = L, MODE1 = L) ......................................................... 8
1.2 PROM PROGRAMMING MODE (MODE0/VPP = H, MODE1 = L) ................................................ 10
1.3 INPUT/OUTPUT CIRCUIT TYPE FOR EACH PIN AND HANDLING OF UNUSED PINS .......... 11
2. MEMORY CONFIGURATION ................................................................................................... 13
3. DIFFERENCES BETWEEN THE mPD78P368A AND mPD78366A ......................................... 14
4. PROM PROGRAMMING ............................................................................................................ 15
4.1 OPERATION MODE ........................................................................................................................ 15
4.2 PROCEDURE FOR WRITING ON PROM (PAGE PROGRAM MODE) ............................... 16
4.3 PROCEDURE FOR WRITING ON PROM (BYTE PROGRAM MODE) ................................ 18
4.4 PROCEDURE FOR READING FROM PROM ........................................................................... 21
5. ERASURE CHARACTERISTICS (mPD78P368AKL-S ONLY) ................................................ 22
6. PROTECTIVE FILM COVERING THE ERASURE WINDOW (mPD78P368AKL-S ONLY) ........ 22
7. SCREENING ONE-TIME PROM PRODUCTS .......................................................................... 22
8. ELECTRICAL SPECIFICATIONS ............................................................................................. 23 H
9. PACKAGE DRAWINGS ............................................................................................................. 39
10. RECOMMENDED SOLDERING CONDITIONS ...................................................................... 41
H
APPENDIX A TOOLS ...................................................................................................................... 42
A.1 DEVELOPMENT TOOLS ................................................................................................................ 42
A.2 EMBEDDED SOFTWARE ............................................................................................................... 47
APPENDIX B DIMENSIONS OF THE CONVERSION SOCKET AND RECOMMENDED
PATTERN ON BOARDS......................................................................................... 49
7

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