SG1825CJ/DESC(1996) Просмотр технического описания (PDF) - Microsemi Corporation
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SG1825CJ/DESC Datasheet PDF : 7 Pages
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PRODUCT DATABOOK 1996/1997
SG1825C/SG2825C/SG3825C
HIGH-SPEED CURRENT-MODE PWM
NOT RECOMMENDED FOR NEW DESIGNS
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Input Voltage (VIN and VC) .......................................................................................... 30V
Analog Inputs:
Error Amplifier and Ramp ........................................................................ -0.3V to 7.0V
Softstart and ILIM/S.D. ................................................................................ -0.3V to 6.0V
Digital Input (Clock) .................................................................................... 1.5V to 6.0V
Driver Outputs ........................................................................................ -0.3V to VC+1.5V
Source / Sink Output Current (each output):
Continuous .............................................................................................................. 0.5A
Pulse, 500ns ............................................................................................................ 2.0A
Softstart Sink Current ................................................................................................ 20mA
Clock Output Current ................................................................................................. 5mA
Error Amplifier Output Current ................................................................................. 5mA
Oscillator Charging Current ....................................................................................... 5mA
Operating Junction Temperature:
Hermetic (J, L Package) ....................................................................................... 150°C
Plastic (DW, N, Q Packages) ............................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (soldering, 10 seconds) ............................................................ 300°C
Note 1. Exceeding these ratings could cause damage to the device.
THERMAL DATA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DW PACKAGE:
65°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Q PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
J PACKAGE:
95°C/W
80°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
L PACKAGE:
80°C/W
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
120°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUTS
INV. INPUT 1
16
VREF
N.I. INPUT 2
15
+VIN
E/A OUTPUT 3 14 OUTPUT B
CLOCK 4
13
VC
RT
5
12
PWR GND
CT
6
11
OUTPUT A
RAMP 7 10 GROUND
SOFTSTART 8
9
ILIM / S.D.
J & N PACKAGE
(Top View)
INV. INPUT
1
N.I. INPUT
2
E/A OUTPUT
3
CLOCK
4
RT
5
CT
6
RAMP
7
SOFTSTART
8
16
+VREF
15
+VIN
14
OUTPUT B
13
VC
12
PWR GND
11
OUTPUT A
10
GROUND
9
ILIM / S.D.
DW PACKAGE
(Top View)
3 2 1 20 19
4
18
5
17
6
16
7
15
8
14
9 10 11 12 13
Q PACKAGE
(Top View)
3 2 1 20 19
4
18
5
17
6
16
7
15
8
14
9 10 11 12 13
L PACKAGE
(Top View)
1. N.C.
2. INV. INPUT
3. N.I. INPUT
4. E/A OUTPUT
5. CLOCK
6. N.C.
7. RT
8. CT
9. RAMP
10. SOFTSTART
11. N.C.
12. ILIM / S.D.
13. GROUND
14. OUTPUT A
15. PWR GND
16. N.C.
17. VC
18. OUTPUT B
19. +VIN
20. VREF
2
Copyright © 1994
Rev. 1.3 6/96
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