SF2109D Просмотр технического описания (PDF) - RF Monolithics, Inc
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Компоненты Описание
производитель
SF2109D Datasheet PDF : 6 Pages
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SM3838-8 Case
8-Terminal Ceramic Surface-Mount Case
3.8 X 3.8 mm Nominal Footprint
0.066
(1.68)
0.055 TYP.
(1.40)
PCB Footprint
TOP VIEW
Case Dimensions
mm
Dimension Min Nom Max Min
A
3.6 3.8 4.0 0.142
B
3.6 3.8 4.0 0.142
C
1.05 1.20 1.35 0.041
D
0.95 1.10 1.25 0.037
E
0.90 1.00 1.10 0.035
F
0.50 0.60 0.70 0.020
G
2.39 2.54 2.69 0.090
H
1.40 1.75 2.05 0.055
Inches
Nom
0.150
0.150
0.047
0.043
0.040
0.024
0.100
0.069
Max
0.157
0.157
0.053
0.049
0.043
0.028
0.110
0.080
Electrical Connections
Connection
Port 1
Differential Input
Port 2
Differential Output
Ground
Single Ended Operation
Differential Operation
Dot Indicates Pin 1
Terminals
1, 2
5, 6
All Others
Return is Ground
Return is Hot
Materials
Solder Pad Ter- Au plating 30 - 60 uInches (76.2-152 uM) over 80-200
mination
uInches (203-508 uM) Ni.
Lid
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phospho-
rus) 100-200 uInches Thick
Body
Al2O3 Ceramic
Pb Free
BOTTOM VIEW
B
C
E
8
8
1
A2
3
7
H7
6
6
5
5
1
2G
3
4
4
D
F
www.RFM.com E-mail: info@rfm.com
©2008 by RF Monolithics, Inc.
Page 5 of 6
SF2109D - 9/18/08
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