LMA110A Просмотр технического описания (PDF) - Filtronic PLC
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LMA110A Datasheet PDF : 3 Pages
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Filtronic
Solid State
Assembly Diagram
.5-6 GHz MESFET Amplifier
LMA110A
Notes:
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845
DSS 004 WD
Internet: http://www.FiltronicSolidState.com
Fax: (408) 970-9950
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