DAC16GS Просмотр технического описания (PDF) - Analog Devices
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DAC16GS Datasheet PDF : 12 Pages
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DAC16
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C unless otherwise noted)
VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +25.0 V
VCC to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V
VEE to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –18.0 V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V
REF GND to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +1.0 V
IREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 8 mA
Digital Input Voltage to DGND . . . . . . . . . . . . . . . . . . . ≤VCC
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
GS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type
24-Lead Plastic DIP (P)
24-Lead Plastic SOL (S)
θJA1
θJC
Units
62
32
°C/W
70
22
°C/W
NOTE
1θJA is specified for worst case mounting conditions, i.e., θJA is specified for
device in socket.
DICE CHARACTERISTICS
VCC DGND IREF CCOMP IOUT AGND
DB15 (MSB)
DB14
REF GND
VEE
DB0 (LSB)
DB13
DB12
DB11
DB10
DB1
DB2
DB3
DB9 DB8 DB7 DB6 DB5 DB4
Die Size 0.129 x 0.153 inch, 19,737 sq. mils
(3.277 x 3.886 mm, 12.73 sq. mm)
The DAC16 Contains 330 Transistors.
Substrate is VEE Polarity.
CAUTION
1. Stresses above those listed under “Absolute Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this
specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device
reliability.
2. Digital inputs and outputs are protected; however, perma-
nent damage may occur on unprotected units from high en-
ergy electrostatic fields. Keep units in conductive foam or
packaging at all times until ready to use. Use proper anti-
static handling procedures.
3. Remove power before inserting or removing units from their
sockets.
PIN CONFIGURATION
24-Lead DIP (P, S)
IREF 1
DGND 2
VCC 3
DB15 (MSB) 4
24 CCOMP
23 IOUT
22 AGND
21 REF GND
DB14 5 DAC16 20 VEE
DB13 6 TOP VIEW 19 DB0 (LSB)
DB12 7 (Not to Scale) 18 DB1
DB11 8
17 DB2
DB10 9
16 DB3
DB9 10
15 DB4
DB8 11
14 DB5
DB7 12
13 DB6
PIN DESCRIPTION
Pin
(P, S) Name
Description
1
2
3
4–19
20
21
22
23
24
IREF
DGND
VCC
DB15–DB0
VEE
REF GND
AGND
IOUT
CCOMP
Reference Current Input
Digital Ground
+5 V Digital Supply
16-Bit Digital Input Bus. DB15 is the MSB.
–15 V Analog Supply
Reference Current Return
Analog Ground/Output Reference
Current Output
Current Ladder Compensation
Model
DAC16GS
DAC16FP
DAC16FS
DAC16GBC
Grade DNL (max)
±1
±2
±2
±1
ORDERING GUIDE
Temperature Ranges
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
+25°C
Package Descriptions
24-Lead SOL
24-Lead PDIP
24-Lead SOL
Die
Package Options
R-24
N-24
R-24
REV. B
–3–
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