MW7IC18100GNR1 Просмотр технического описания (PDF) - Freescale Semiconductor

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MW7IC18100GNR1

1990 MHz, 100 W, 28 V GSM/GSM EDGE RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIERS

Freescale Semiconductor 

PRODUCT DOCUMENTATION

Refer to the following documents to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family

• AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over - Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

0

1

2

Date

May 2007

June 2007

Apr. 2008

Description

• Initial Release of Data Sheet

• Removed Case Operating Temperature from Maximum Ratings table, p. 2. Case Operating Temperature

rating will be added to the Maximum Ratings table when parts’ Operating Junction Temperature is

increased to 225°C.

• Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related

“Continuous use at maximum temperature will affect MTTF” footnote added and changed 200°C to 225°C

in Capable Plastic Package bullet, p. 1, 2

• Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 2

• Updated PCB information to show more specific material details, Figs. 3, 27, Test Circuit Schematic, p. 4,

14

• Updated Part Numbers in Tables 6, 8, Component Designations and Values, to RoHS compliant part

numbers, p. 4, 14

• Replaced Case Outline 1617 - 01 with 1617 - 02, Issue A, p. 22 - 24. Revised cross - hatched area for

exposed heat spreader. Added pin numbers 1, 12, 13, and 14 to Sheets 1 and 2. Corrected mm Min and

Max values for dimension A1 to 0.99 and 1.09, respectively.

• Replaced Case Outline 1618 - 01 with 1618 - 02, Issue A, p. 25 - 27. Added pin numbers 1, 12, 13, and 14

and Pin 1 Index designation to Sheet 1. Corrected dimensions e and e1 on Sheet 1. Removed Pin 5

designation from Sheet 2.

• Replaced Case Outline 1621 - 01 with 1621 - 02, Issue A, p. 28 - 30. Added pin numbers 1, 12, 13, and 14

and Pin 1 Index designation to Sheet 1. Corrected dimensions e and e1 on Sheets 1 and 3. Removed Pin 5

designation from Sheet 2.

RF Device Data

Freescale Semiconductor

MW7IC18100NR1 MW7IC18100GNR1 MW7IC18100NBR1

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