MMA7260 Просмотр технического описания (PDF) - Freescale Semiconductor

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производитель

MMA7260

±1.5g - 6g Three Axis Low-g Micromachined Accelerometer

Freescale Semiconductor 

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package.

With the correct footprint, the packages will self-align when

subjected to a solder reflow process. It is always

recommended to design boards with a solder mask layer to

avoid bridging and shorting between solder pads.

The flag underneath the package is internally connected to

ground. It is not recommended for the flag to be soldered

down.

Pin 1 ID

(non-metallic)

Do not solder down

flag and 4 corner

ground pads on the

package for

consumer application

Do not place any top

metal patterns or via

structures beneath

the package

Note: The die pad (flag) is not generally recommended to be

soldered down for consumer product application. All dimensions

are in mm.

Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for

Consumer Grade Products and Applications

Sensors

Freescale Semiconductor

MMA7260QT

7

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