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MAX6639(2005) Просмотр технического описания (PDF) - Maxim Integrated

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MAX6639 Datasheet PDF : 22 Pages
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2-Channel Temperature Monitor with Dual,
Automatic, PWM Fan-Speed Controller
Typical Operating Circuit
5V
VFAN
(5V OR 12V)
3.3V TO 5.5V
5V
CPU
DXP1 VCC ADD TACH1
VFAN
(5V OR 12V)
DXN
PWM1
5V
DXP2
PWM2
MAX6639
3.3V TO 5.5V
GPU
TO SMBus
SDA
MASTER
SCL
3.3V TO 5.5V
TACH2
3.3V TO 5.5V
ALERT
3.3V TO 5.5V
OT
TO SYSTEM SHUTDOWN
3.3V TO 5.5V
TO CLOCK THROTTLE
THERM
FANFAIL
GND
near high-voltage traces is no longer an issue.
5) Route as few vias and crossunders as possible to
minimize copper/solder thermocouple effects.
6) When introducing a thermocouple, make sure that
both the DXP and the DXN paths have matching
thermocouples. In general, PC board-induced ther-
mocouples are not a serious problem. A copper
solder thermocouple exhibits 3µV/°C, and it takes
approximately 200µV of voltage error at DXP/DXN
to cause a +1°C measurement error, so most para-
sitic thermocouple errors are swamped out.
7) Use wide traces. Narrow traces are more inductive
and tend to pick up radiated noise. The 10-mil widths
and spacings recommended are not absolutely nec-
essary (as they offer only a minor improvement in
leakage and noise), but use them where practical.
8) Placing an electrically clean copper ground plane
between the DXP/DXN traces and traces carrying
high-frequency noise signals helps reduce EMI.
Chip Information
TRANSISTOR COUNT: 39,283
PROCESS: BiCMOS
20 ______________________________________________________________________________________

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