MAX3942 Просмотр технического описания (PDF) - Maxim Integrated
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MAX3942 Datasheet PDF : 10 Pages
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10Gbps Modulator Driver
GND GND
MAX3942
GND
50Ω
50Ω
GND
OUT-
OUT+
VEE
VEE
Exposed-Pad Package
The exposed pad on the 24-pin QFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3942
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note HFAN-08.1: Thermal
Considerations of QFN and Other Exposed-Paddle
Packages for additional information.
Chip Information
TRANSISTOR COUNT: 1918
PROCESS: SiGe Bipolar
Figure 6. Simplified Output Circuit
Pin Configuration
TOP VIEW
DATA+ 1
DATA- 2
GND 3
GND 4
CLK+ 5
CLK- 6
MAX3942
18 VEE
17 GND
16 OUT+
15 OUT-
14 GND
13 VEE
24 THIN QFN (4mm x 4mm)
EXPOSED PAD CONNECTED TO GROUND
Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages.
PART
MAX3942ETG
PACKAGE TYPE
24 Thin QFN
(4mm ✕ 4mm ✕ 0.8mm)
PACKAGE CODE
T2444-1
Revision History
Pages changed at Rev 1: 1, 2, 10.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2007 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products.
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