MAX3815 Просмотр технического описания (PDF) - Maxim Integrated

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MAX3815

TMDS Digital Video Equalizer for DVI/HDMI Cables

Maxim Integrated 

TMDS Digital Video Equalizer for DVI/HDMI

Cables

TYPICAL MAX3815 CABLE REACH

60

50

40

30

20

UASSTHAAABLDLLEEDDCVAAIRBRELAAET=LEESMNUAGPXT3HT8O1R51A.N6G5GEbps

10 LIMIT OF CABLE LENGTH WITHOUT EQ AT 1.65Gbps

TYPICAL DVI WIRE GAUGE RANGE

5

32

30

28

26

24

22

AWG AWG AWG AWG AWG AWG

DVI WIRE GAUGE

Figure 6. Cable Reach

within a twisted pair (STP or UTP), usually a result of

cable twist or dielectric imbalance. Refer to Application

Note HFAN-04.5.4: ‘Jitter Happens’ when a Twisted

Pair is Unbalanced for more information.

Layout Considerations

The data and clock inputs are the most critical paths for

the MAX3815 and great care should be taken to mini-

mize discontinuities on these transmission lines

between the connector and the IC. Here are some sug-

gestions for maximizing the performance of the

MAX3815:

• The data and clock inputs should be wired directly

between the cable connector and IC without stubs.

• Input and output data channel designations are

only a guide. Polarity assignments can be swapped

and channel paths can be interchanged.

• An uninterrupted ground plane should be posi-

tioned beneath the high-speed I/Os.

• Ground-path vias should be placed close to the IC

and the input/output interfaces to allow a return cur-

rent path to the IC and the DVI cable.

• Maintain 100Ω differential transmission line imped-

ance into and out of the MAX3815.

• Use good high-frequency layout techniques and

multilayer boards with an uninterrupted ground

plane to minimize EMI and crosstalk.

Exposed-Pad Package

The exposed pad on the 48-pin TQFP-EP provides a

very low thermal resistance path for heat removal from

the IC. The pad is also electrical ground on the

MAX3815 and must be soldered to the circuit board

ground for proper thermal and electrical performance.

Refer to Maxim Application Note HFAN-08.1: Thermal

Considerations of QFN and Other Exposed-Paddle

Packages for additional information.

Chip Information

PROCESS: SiGe BiPOLAR

Package Information

(For the latest package outline information, go to

www.maxim-ic.com/packages.)

PACKAGE TYPE

48 TQFP

DOCUMENT NO.

21-0065

_______________________________________________________________________________________ 9

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