MAX3345E Просмотр технического описания (PDF) - Maxim Integrated

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MAX3345E

±15kV ESD-Protected USB Transceivers in UCSP with USB Detect

Maxim Integrated 

±15kV ESD-Protected USB Transceivers

in UCSP with USB Detect

IEC 1000-4-2

The IEC 1000-4-2 standard covers ESD testing and per-

formance of finished equipment; it does not specifically

refer to integrated circuits. The MAX3344E/MAX3345E

help the user design equipment that meets level 4 of IEC

1000-4-2, without the need for additional ESD-protection

components.

The major difference between tests done using the

Human Body Model and IEC 1000-4-2 is a higher peak

current in IEC 1000-4-2, because series resistance is

lower in the IEC 1000-4-2 model. Hence, the ESD with-

stand voltage measured to IEC 1000-4-2 is generally

lower than that measured using the Human Body Model.

Figure 1c shows the IEC 1000-4-2 model.

The Air-Gap Discharge Method involves approaching

the device with a charged probe. The Contact

Discharge Method connects the probe to the device

before the probe is energized.

Machine Model

The Machine Model for ESD tests all pins using a 200pF

storage capacitor and zero discharge resistance. Its

objective is to emulate the stress caused by contact that

occurs with handling and assembly during manufactur-

ing. All pins require this protection during manufactur-

ing. Therefore, after PC board assembly, the Machine

Model is less relevant to I/O ports.

Applications Information

External Components

External Resistors

Two external 23.7Ω ±1% to 27.4Ω ±1%, 1/2W resistors

are required for USB connection. Place the resistors

in between the MAX3344E/MAX3345E and the USB

connector on the D+ and D- lines (see the Typical

Operating Circuit).

External Capacitors

Use three external capacitors for proper operation. Use

a 0.1µF ceramic for decoupling VL, a 1µF ceramic for

decoupling VCC, and a 1.0µF (min) ceramic or plastic

filter capacitor on VTRM. Return all capacitors to GND.

UCSP Applications Information

For the latest application details on UCSP construction,

dimensions, tape carrier information, printed circuit board

techniques, bump-pad layout, and recommended reflow

temperature profile, as well as the latest information on

reliability testing results, refer to the Application Note

UCSP—A Wafer-Level Chip-Scale Package available on

Maxim’s website at www.maxim-ic.com/ucsp.

Chip Information

TRANSISTOR COUNT: 2162

PROCESS: BiCMOS

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