MAX3272 Просмотр технического описания (PDF) - Maxim Integrated

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производитель

MAX3272

+3.3V, 2.5Gbps Low-Power Limiting Amplifiers

Maxim Integrated 

+3.3V, 2.5Gbps Low-Power

Limiting Amplifiers

Typical Operating Circuit (continued)

+3.3V

CAZ

+3.3V

CAZ1 CAZ2 VCC

OUTPOL

MAX3272

MAX3271

IN+

0.1µF

0.1µF

100Ω

IN-

OUT+

OUT-

CCLOS

CLOS

TH SQUELCH

GND LOS LOS LEVEL

RTH

LOSS

OF

SIGNAL

*THE MAX3202E PROVIDES ESD PROTECTION ON THE LOS PIN

+3.3V

VCC

SDI+

SDO+

SDO-

MAX3873

CDR SCLKO+

SDI-

SCLKO-

GND

+3.3V

VCC

I/01 MAX3202E*

GND

Wire Bonding Die

For high-current density and reliable operation, the

MAX3272 uses gold metallization. Make connections to

the dice with gold wire only, and use ball-bonding tech-

niques (wedge bonding is not recommended). Die pad

dimensions are 94.4 microns by 94.4 microns. Die

thickness is 15 mils (0.375mm).

10 ______________________________________________________________________________________

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