MAX1809 Просмотр технического описания (PDF) - Maxim Integrated

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MAX1809

3A, 1MHz, DDR Memory Termination Supply

Maxim Integrated 

3A, 1MHz, DDR Memory Termination Supply

ABSOLUTE MAXIMUM RATINGS

VCC, IN to GND ........................................................-0.3V to +6V

IN to VCC.............................................................................±0.3V

GND to PGND.....................................................................±0.3V

SHDN, SS, FB, TOFF, RREF,

EXTREF to GND.......................................-0.3V to (VCC + 0.3V)

LX Current (Note 1).............................................................±4.7A

REF Short Circuit to GND Duration ............................Continuous

Continuous Power Dissipation (TA = +70°C)

28-Pin QFN (derate 20mW/°C above +70°C;

part mounted on 1in2 of 1oz copper) ..............................1.6W

16-Pin QSOP (derate 12.5mW/°C above +70°C;

part mounted on 1in2 of 1oz copper) .................................1W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: LX has clamp diodes to PGND and IN. If continuous current is applied through these diodes, thermal limits must be

observed.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VIN = VCC = 3.3V, VEXTREF = 1.1V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)

PARAMETER

Input Voltage

Feedback Voltage Accuracy

(VFB - VEXTREF)

Feedback Load Regulation Error

External Reference Voltage

Range

SYMBOL

CONDITIONS

VIN,VCC

VIN = VCC = 3V to 5.5V, ILOAD = 0,

VEXTREF = 1.25V (Note 2)

∆VFB ILOAD = -3A to +3A, VEXTREF = 1.25V

VEXTREF VIN = VCC = 3V to 5.5V

MIN

3.0

-12

VREF -

0.01

TYP

20

MAX

5.5

+12

VIN -

1.7

Reference Voltage

Reference Load Regulation

PMOS Switch

On-Resistance

NMOS Switch

On-Resistance

Current-Limit Threshold

Switching Frequency

No Load Supply Current

Shutdown Supply Current

Thermal-Shutdown Threshold

Undervoltage Lockout Threshold

FB Input Bias Current

Off-Time

Startup Off-Time

On-Time

VREF

RPMOS

RNMOS

ILIMIT

fSW

ICC

IIN

ISHDN

IFB

tOFF

IREF = -1µA to +10µA

ILX = 0.5A

VIN = 4.5V

VIN = 3V

ILX = 0.5A

VIN = 4.5V

VIN = 3V

VIN > VLX

(Note 3)

fSW = 500kHz

fSW = 500kHz

SHDN = GND, ICC + IIN

Hysteresis = 15°C

VCC falling, hysteresis = 90mV

VFB = VEXTREF + 0.1V

RTOFF = 30.1kΩ

RTOFF = 110kΩ

RTOFF = 499kΩ

tON (Note 3)

1.078

3.5

2.5

0

0.24

0.9

3.8

0.35

1.100

0.5

90

110

70

80

4.1

1

16

<1

160

2.6

60

0.30

1.0

4.5

4 x tOFF

1.122

2.0

200

250

150

200

4.7

1

15

2.7

250

0.37

1.1

5.2

UNITS

V

mV

mV

V

V

mV

mΩ

mΩ

A

MHz

mA

µA

°C

V

nA

µs

µs

µs

2 _______________________________________________________________________________________

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