AD7849AN Просмотр технического описания (PDF) - Analog Devices
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AD7849AN Datasheet PDF : 15 Pages
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AD7849
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +17 V
VCC to DGND2 . . . . . . . . . . . . . . . . . . –0.4 V, VDD + 0.4 V or
+7 V (Whichever Is Lower)
VSS to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to –17 V
VREF+ to DGND . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V
VREF– to DGND . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V
VOUT to DGND3 . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V or
± 10 V (Whichever Is Lower)
ROFS to DGND . . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V
Digital Input Voltage to DGND . . . . . . –0.4 V to VCC + 0.4 V
Input Current to any Pin Except Supplies4 . . . . . . . . . ± 10 mA
Operating Temperature Range
Commercial/Industrial (A, B, C Versions). . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . . 875 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 102°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +260°C
SOP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 74°C/W
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 875 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 71°C/W
Lead Temperature, Soldering (Soldering 10 secs) . . . 260°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2VCC must not exceed VDD by more than 0.4 V. If it is possible for this to happen
during power-up or power-down (for example, if VCC is greater than +0.4 V while
VDD is still 0 V), the following diode protection scheme will ensure protection.
VDD
VCC
1N4148
SD103C
1N5711
1N5712
VDD
VCC
AD7849
3VOUT may be shorted to DGND, +10 V, –10 V, provided that the power dissipation
of the package is not exceeded.
4Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7849 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model
AD7849AN
AD7849BN
AD7849CN
AD7849AR
AD7849BR
AD7849CR
AD7849TQ
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
Resolution
(Bits)
14
16
16
14
16
16
16
Bipolar
INL (LSBs)
±3
±8
±4
±3
±8
±4
±8
*N = Plastic DIP; R = SOP (Small Outline Package); Q = Cerdip.
Package
Option*
N-20
N-20
N-20
R-20
R-20
R-20
Q-20
PIN CONFIGURATION
VREF+ 1
20 ROFS
VREF– 2
19 VOUT
VSS 3
SYNC 4
18 NC
17 VDD
SCLK 5 AD7849 16 AGND
VCC
6
TOP VIEW
(Not to Scale)
15
RSTOUT
SDOUT 7
14 RSTIN
DCEN 8
13 CLR
BIN/COMP 9
DGND 10
12 SDIN
11 LDAC
NC = NO CONNECT
–4–
REV. B
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