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HI-201H Просмотр технического описания (PDF) - Intersil

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HI-201H Datasheet PDF : 11 Pages
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Die Characteristics
DIE DIMENSIONS
2440µm x 2860µm x 485µm
METALLIZATION
Type: CuAl
Thickness: 16kÅ ±2kÅ
Metallization Mask Layout
A1
OUT1
HI-201HS
PASSIVATION
Type: Nitride Over Silox
Nitride Thickness: 3.5kÅ ±1kÅ
Silox Thickness: 12kÅ ±2kÅ
WORST CASE CURRENT DENSITY
9.5 x 104 A/cm2
HI-201HS
A2
OUT2
IN1
IN2
V-
V+
GND
IN4
IN3
OUT4
A4
OUT3
A3
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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