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HEF4093BP Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание
производитель
HEF4093BP
NXP
NXP Semiconductors. NXP
HEF4093BP Datasheet PDF : 15 Pages
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NXP Semiconductors
15. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
HEF4093B
Quad 2-input NAND Schmitt trigger
SOT27-1
D
L
Z
e
b
14
pin 1 index
A2 A
A1
wM
b1
8
ME
c
(e 1)
MH
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36 19.50 6.48
0.23 18.55 6.20
2.54
inches
0.17
0.02
0.13
0.068 0.021 0.014
0.044 0.015 0.009
0.77
0.73
0.26
0.24
0.1
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
e1
7.62
0.3
L
3.60
3.05
0.14
0.12
ME
8.25
7.80
0.32
0.31
MH
w
Z (1)
max.
10.0
8.3
0.254
2.2
0.39
0.33
0.01 0.087
OUTLINE
VERSION
SOT27-1
IEC
050G04
REFERENCES
JEDEC
JEITA
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 12. Package outline SOT27-1 (DIP14)
HEF4093B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
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