HAA1105W Просмотр технического описания (PDF) - STANLEY ELECTRIC CO.,LTD.
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HAA1105W Datasheet PDF : 2 Pages
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s Absolute Maximum Ratings
Item
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Red
Symbol HBR, HKR
Pd
60(HBR),75(HKR)
IF
30
IFM
70
VR
4
Topr
Tstg
∆IF
Orange
Yellow Yellow-Green
HAA
HAY
HPY
75
75
75
30
30
30
70
70
70
4
4
4
-40 to +100
-40 to +120
1.0 (DC) 2.33 (Pulse)
Green
HPG
75
30
70
4
(Ta=25°C)
Pure Green
Units
HBG
75
mW
30
mA
70
mA
4
V
-40 to +85 °C
-40 to +100 °C
0.42 (DC) 0.93 (Pulse) mA/°C
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
The current derating for operation applies when the temperature is above 25°C for HBG and 75°C for HVR, HBR, HKR, HAA, HAY, HPY & HPG
s Taping Specifications
φ
1.5
+0.1
0
4 +0.1
(1.8)
(0.25)
for Reverse
Mount Type
Quantity on tape:
2000 pieces
per reel
( φ 1.1)
Center
Hole
2+0.05
4+0.1
(0.5)
(2.2)
Cathode
s Taping Specifications
φ
1.5
+0.1
0
4+0.1
(1.85)
(0.25)
Center
Hole
(φ 1.1)
Center
Hole
2 + 0.05
4+0.1
(2.1)
for Standard
Mount Type
Quantity on tape:
2000 pieces
per reel
φ 21+0.8
2+0.5
Direction to pull
RR
s Operation Current Derating Chart (DC)
TR
Cathode
Direction to pull
φ 13+0.2
11.4+1
9+0.3
φ 180+30
HAA, HAY, HPG,
HPY, HBR, HKR
HBG
s Spatial Distribution
(X & Y)
(X & Y)
HKR, HAA, HAY, HPY, HPG, HBG
HBR
s Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Temperature
Pre-heating rise: 5°C/sec.
120
Cooling:
—5°C/sec.
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGH__1105W-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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