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FX4040G711ADJT1 Просмотр технического описания (PDF) - Vishay Semiconductors

Номер в каталоге
Компоненты Описание
производитель
FX4040G711ADJT1 Datasheet PDF : 6 Pages
1 2 3 4 5 6
FX4040G7XX
Vishay
SOLDERING PROFILE
All of the components must be dried prior to assembly as follows:
1.Samples and package type B1 and B5, bulk components - the recommended drying process is to be done at 125°C for 48 hours.
2. For package type T5 - per JEDEC J-STD-033 level 5.
For taped components the recommended drying process is to be done at maximum 70°C.
RECOMMENDED SOLDERING PROFILE
217°C/sec
250
Max
200
150
100 0.5-2.5°C/sec
0.5-1°C/sec
30-60sec
Pre-Heating
zone
Time above
liquidus
30-90sec
2.5°C/sec
Max
50
0
50
100
150
200
Time (sec)
RECOMMENDED LEAD (PB)-FREE SOLDERING PROFILE
240°C ± 5°C
250
200
150
0.5-2.5°C/sec
100
0.5-1°C/sec
Time above
liquidus
30-90sec
30-60sec
Pre-Heating
zone
250
300
2.5°C/sec
Max
50
0
www.vishay.com
90
50
100
150
200
250
300
350
400
Time (sec)
For technical questions, contact FunctionPAK@vishay.com
For marketing questions, contact FunctionPAK.marketing@vishay.com
Document Number: 10138
Revision: 22-Sep-04

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