CRF24060D Просмотр технического описания (PDF) - Cree, Inc
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CRF24060D Datasheet PDF : 8 Pages
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DIE Dimensions (units in microns)
Overall die size 5260 x 1195 microns, die thickness 100 microns
All pads must be bonded for electrical connection.
PRELIMINARY
Assembly Notes:
CREE
• Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at www.cree.com/wireless.
• Vacuum collet is the preferred method of pick-up.
• The backside of the die is the source (ground) contact.
• Use the die label for the correct orientation.
• Die back side plating is 5 microns thick gold minimum.
• Use caution to prevent air bridge damage.
• Thermosonic ball or wedge bonding is the preferred connection method.
• Gold wire shall be used for connections.
• Use caution not to probe on the vias.
Copyright © 2004-2006 Cree, Inc. All rights reserved. Permission is given to reproduce this document provided the entire document
(including this copyright notice) is duplicated. The information in this document is subject to change without notice. Cree and the Cree
logo are registered trademarks and Wireless by Cree is a trademark of Cree, Inc. Other trademarks, product and company names are
the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
CRF24060D Preliminary Rev 1.1
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/wireless
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