AMS2930 Просмотр технического описания (PDF) - Advanced Monolithic Systems Inc
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AMS2930 Datasheet PDF : 9 Pages
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AMS2930
Electrical Characteristics
Electrical Characteristics at VIN=14V, VOUT =3V IO =150mA, TJ=25°C, R1 =27k, C2 = 100µF unless otherwise specified.
PARAMETER
Adjustable Version
Reference Voltage
Output Voltage Range
CONDITIONS
(Note 2)
IO
≤
150
mA,
-40°C
≤T
J
≤
125°C,
R1=27k,
Measured from VOUT to Adjust Pin
Min.
1.14
1.08
3
AMS2930C
Typ.
1.20
1.32
24
Max.
1.26
Units
V
V
V
Line Regulation
Load Regulation
Dropout Voltage
Quiescent Current
Output Noise Voltage
Output Impedance
Long Term Stability
Ripple Rejection
Maximum Operational Input
Voltage
Maximum Line Transient
Reverse Polarity Input Voltage,
D/C
Reverse Polarity Input Voltage,
Transient
On/Off Threshold Voltage
On
Off
On/Off Threshold Current
VOUT
+
0.6V
≤V
IN
≤
26V
5mA ≤I ≤ 150 mA
O
I ≤10 mA
O
I = 150 mA
O
I = 10 mA
O
I = 150 mA
O
During Shutdown RL = 500Ω
10Hz-100kHz
100mADC and 10mArms,100Hz=10kHz
T =1000hr
fO = 120Hz
IO = 10mA, Reference Voltage ≤ 1.5V
T = 1ms, τ ≤100ms
RL = 500Ω, VO ≥ -0.3V
RL = 500Ω, T = 1ms, τ ≤100ms
VO = 3V
.02
0.3
0.05
0.3
0.4
15
0.8
100
40
0.4
0.02
26
33
60
70
-15
-30
-50
-80
2.0
3.25
2.2
20
1.5
mV
1
%
0.2
V
0.6
V
1
mA
mA
1
mA
µVrms/V
mΩ
%/1000hr
%/V
V
V
V
V
1.2
V
V
50
µA
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test
conditions, see the Electrical Characteristics tables.
Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for
TA = TJ = 25°C.
Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W for
the TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance
junction-to-case of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be
reduced by increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area, ϕ JA is 50°C/W; with 1 square inch of
copper area ϕ JA is 37°C/W; and with 1.6 or more square inches of copper area ϕ JA is 32°C/W.
Advanced Monolithic Systems, Inc. www.advanced-monolithic.com Phone (925) 443-0722 Fax (925) 443-0723
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