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BGA416(2002) Просмотр технического описания (PDF) - Infineon Technologies

Номер в каталоге
Компоненты Описание
производитель
BGA416
(Rev.:2002)
Infineon
Infineon Technologies Infineon
BGA416 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
BGA416
Maximum Ratings
Parameter
Voltage at pin RFout
Current into pin RFin
Device current 1)
Input power
Total power dissipation, TS < 123°C 2)
Junction temperature
Ambient temperature range
Storage temperature range
Thermal resistance: junction-soldering point
Symbol
VOUT
IIN
ID
PIN
Ptot
Tj
TA
TSTG
Rth JS
Notes:
All Voltages refer to GND-Node
1) Device current is equal to current into pin RFout
2) TS is measured on the ground lead at the soldering point
Value
6
0.5
20
8
100
150
-65 ... +150
-65 ... +150
270
Unit
V
mA
mA
dBm
mW
°C
°C
°C
K/W
Electrical Characteristics at TA=25°C (measured in test circuit specified in fig. 1)
VCC=3V, unless otherwise specified
Parameter
Symbol min. typ. max. Unit
Maximum available power gain f=0.9GHz GMA
f=1.8GHz
23
dB
14
Insertion power gain
f=0.9GHz |S21|2
17
dB
f=1.8GHz
11
Reverse isolation
f=0.9GHz |S12|
62
dB
f=1.8GHz
40
Noise figure (ZS=50Ω)
f=0.9GHz F50
f=1.8GHz
1.3
dB
1.6
Output power at 1dB gain compression
(ZS=ZL=50Ω)
f=0.9GHz
f=1.8GHz
P-1dB
dBm
-3
-3
Output third order intercept point
(ZS=ZL=50Ω)
f=0.9GHz
f=1.8GHz
OIP3
dBm
14
14
Device current
ID
5.5
mA
Data sheet
5

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