APL5912 Просмотр технического описания (PDF) - Anpec Electronics

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Компоненты Описание

производитель

APL5912

0.8V Reference Ultra Low Dropout (0.2V@5A) Linear Regulator

Anpec Electronics 

APL5912

Ordering and Marking Information

APL5912

Assembly Material

Handling Code

Temperature Range

Package Code

Package Code

KA : SOP-8P

Operating Ambient Temperature Range

C : 0 to 70 oC

Handing Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APL5912 KA :

APL5912

XXXXX

XXXXX - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Absolute Maximum Ratings (Note 1)

Symbol

Parameter

Rating

Unit

VCNTL

VIN

VI/O

VPOK

PD

TJ

TSTG

TSDR

VCNTL Supply Voltage (VCNTL to GND)

VIN Supply Voltage (VIN to GND)

EN and FB to GND

POK to GND

Power Dissipation

Junction Temperature

Storage Temperature

Maximum Lead Soldering Temperature, 10 Seconds

-0.3 ~ 7

V

-0.3 ~ 3.3

V

-0.3 ~ VCNTL+0.3

V

-0.3 ~ 7

V

3

W

150

oC

-65 ~ 150

oC

260

oC

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

θJA

Parameter

Junction-to-Ambient Thermal Resistance in Free Air (Note 2)

θJC

Junction-to-Case Thermal Resistance (Note 3)

SOP-8P

SOP-8P

Typical Value

40

17

Unit

oC/W

oC/W

Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad

of SOP-8P is soldered directly on the PCB.

Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.

1

8

2

VIN

7

3

6

4

5

Measured Point

PCB Copper

Copyright © ANPEC Electronics Corp.

2

Rev. A.10 - Oct., 2009

www.anpec.com.tw

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