AH215 Просмотр технического описания (PDF) - Unspecified

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AH215

1 Watt, High Linearity HBT Amplifier

Unspecified 

AH215

1 Watt, High Gain HBT Amplifier

Outline Drawing

The Communications Edge TM

Product Information

Product Marking

The component will be marked with an

“AH215-S8” designator with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

Land Pattern

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes between 500 and 1000V

Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235° C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85° C

Thermal Resistance, Rth (1)

33° C / W

Junction Temperature, Tjc (2)

159° C

Notes:

1. The thermal resistance is referenced from the hottest part of

the junction to the ground slug underneath the device.

2. This corresponds to the typical biasing condition of +5V,

450 mA at an 85° Ccase temperature. A minimum MTTF

of 1 million hours is achieved for junction temperatures

below 247° C. Tjc is a function of the voltage at pins 6 & 7

and the current applied to pins 6, 7, and 8 and can be

calculated by:

Tjc = Tcase + Rth * Vcc * Icc

MTTF vs. GND Tab Temperature

1000000

100000

10000

1000

100

50

60 70 80 90 100

Tab temperature (° C)

1. A heatsink underneath the area of the PCB

for the mounted device is strictly required for

proper thermal operation. Damage to the

device can occur without the use of one.

2. Ground / thermal vias are critical for the

proper performance of this device. Vias

should use a .35mm (#80 / .0135”) diameter

drill and have a final plated thru diameter

of .25 mm (.010”).

3. Add as much copper as possible to inner and

outer layers near the part to ensure optimal

thermal performance.

4. Mounting screws can be added near the part

to fasten the board to a heatsink. Ensure that

the ground / thermal via region contacts the

heatsink.

5. Do not put solder mask on the backside of the

PC board in the region where the board

contacts the heatsink.

6. RF trace width depends upon the PC board

material and construction.

7. Use 1 oz. Copper minimum.

8 All dimensions are in millimeters (inches).

Angles are in degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800- WJ1-4401 • FAX: 408-577-6621 • e- mail: sales@wj.com • Web site: www.wj.com

July 2004

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