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1N5806U Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
1N5806U
ST-Microelectronics
STMicroelectronics ST-Microelectronics
1N5806U Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
1N5806U
3
Ordering information
Ordering information
Table 7. Ordering information(1)
Order code
ESCC detailed
specification
Package Lead finish
Marking(2)
EPPL
Mass
Packing
1N5806UA1
-
Gold
5806
-
1N5806U01A 5101/014/13 LCC2A
Gold 510101413 Y 0.12 g Waffle pack
1N5806U02A 5101/014/14
Solder dip 510101414 -
1. Contact ST sales office for information about the specific conditions for products in die form.
2. Specific marking only. The full marking includes in addition:
For the engineering models: ST logo, date code, country of origin (FR).
For ESCC flight parts: ST logo, date code, country of origin (FR), ESA logo, serial number of the part within the
assembly lot.
4
Other information
4.1
Date code
Date code is structured as describe below:
EM xyywwz
ESCC flight yywwz
Where:
x (EM only): 3, assembly location Rennes (France)
yy: last two digits year
ww: week digits
z: lot index in the week
4.2
Documentation
In Table 8 is a summary of the documentation provided with each type of products.
Table 8. Documentation provided with each type of products
Quality level
Documentation
Engineering model
ESCC flight
Certificate of conformance
DocID15986 Rev 3
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