Specifications
SPECIFICATIONS
Package Details
0.51
TYP
1.56 TYP
0.55
0.53
13.7
Glass Lid
Die
Base
0.5 0.86
Viewed from side
The optical array is centred within the
package to a tolerance of ± 0.2 mm, and
rotated no more than ± 0.5o
Tolerances on package dimensions ±10%
2.16 Glass lid placement is controlled so that no
PIN 1 package overhang exists.
1.016 PITCH TYP
Viewed from below
All dimensions in millimetres
Spectral Response
1.0
0.8
0.6
0.4
0.2
0
Absolute Maximum Ratings
Wavelength nm
Parameter
Value
Supply Voltage
-0.5 to +7.0 volts
Voltage on other input pins
Temperature under bias
Storage Temperature
-0.5 to VDD + 0.5 volts
-15oC to 85oC
-30oC to 125oC
Maximum DC TTL output Current Magnitude 10mA (per o/p, one at a time, 1sec. duration)
Note: Stresses exceeding the Absolute Maximum Ratings may induce failure. Exposure to absolute
maximum ratings for extended periods may reduce reliability. Functionality at or above these
conditions is not implied.
09/04/97
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