STPS41L60CG Просмотр технического описания (PDF) - STMicroelectronics
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STPS41L60CG Datasheet PDF : 12 Pages
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Document CD00002861 Revision 6.1
Characteristics
IN APPROVAL
7 / 12
STPS41L60C
Figure 8.
IR(mA)
1.E+03
Reverse leakage current versus
reverse voltage applied
(typical values)
Tj=150°C
1.E+02
Tj=125°C
1.E+01
Tj=100°C
Tj=75°C
1.E+00
Tj=50°C
Figure 9.
C(nF)
10.0
Junction capacitance versus
reverse voltage applied
(typical values)
F=1 MHz
VOSC= 30 mV
Tj=25 °C
1.0
1.E-01
1.E-02
0
Tj=25°C
VR(V)
5 10 15 20 25 30 35 40 45 50 55 60
0.1
1
VR(V)
10
100
Figure 10. Forward voltage drop versus
forward current
IFM(A)
100
Tj=125 °C
(Maximum values)
Tj=125 °C
(Typical values)
10
Tj=25 °C
(Maximum values)
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab (STPS41L60CG only)
Rth(j-a)(°C/W)
80
Epoxy printed circuit board
70
copper thickness = 35 µm
60
50
40
30
20
10
0
1.2
0
S(cm²)
5
10
15
20
25
30
35
40
Figure 12. Reverse safe operating area (tp < 1 µs, Tj > 150 °C)
IARM (A)
50
45
Forbidden area
40
35
Operating area
30
25
VARM (V)
20
60
65
70
75
80
85
90
4/9
Copyright STMicroelectronics
Doc ID 8616 Rev 6
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