STPS2L60UF Просмотр технического описания (PDF) - STMicroelectronics
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STPS2L60UF Datasheet PDF : 9 Pages
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STPS2L60
Characteristics
Figure 13. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 14. Forward voltage drop versus
forward current
(maximum values, low level)
C(pF)
1000
100
10
1
VR(V)
10
F=1MHz
VOSC=30mV
Tj=25°C
100
IFM(A)
10
9
Tj=125°C
(maximum values)
8
7
6
Tj=125°C
(typical values)
5
Tj=25°C
4
(maximum values)
3
2
1
VFM(V)
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Figure 15. Thermal resistance junction to
Figure 16. Thermal resistance versus lead
ambient versus copper surface
length (DO-41)
under each lead (SMA and SMB flat)
Rth(j-a)(°C/W)
130
120
epoxy printed circuit board FR4, copper thickness: 35 µm
110
100
Rth(°C/W)
120
100
Rth(j-a)
90
80
80
SMA
70
60
60
50
Rth(j-I)
40
SMBflat
40
30
20
20
10
S(Cu)(cm²)
Lleads(mm)
0
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
5
10
15
20
25
Doc ID 9173 Rev 6
5/9
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